ASE Group
| Public | |
| Traded as | NYSE: ASX |
| Industry | Semiconductor assembly, testing & packaging |
| Founded | 1984 |
| Founders | Jason Chang Richard Chang |
| Headquarters | Kaohsiung, Taiwan |
|
Area served
|
Worldwide |
| Revenue | USD $8.72 billion (2015) |
|
Number of employees
|
65,695 |
| Website | www |
Advanced Semiconductor Engineering, Inc., also known as ASE Group, is a Taiwan-based provider of independent semiconductor assembling and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.[1]
Overview
The company was founded in 1984 by brothers Jason Chang and Richard Chang, who opened its first factory in Kaohsiung, Taiwan.[2] Jason Chang currently serves as company chairman and is on the 2016 Forbes’ list of the world’s billionaires.[3]
As of April 1, 2016, the company's market cap was USD 8.77 billion.[4]
Technology
According to the market research firm Gartner, ASE is the largest Outsourced Semiconductor Assembly and Test (OSAT) provider, with 19 percent market share.[5] The company offers services such as semiconductor assembly, packaging and testing.[6] The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D and 3D packaging, system in package (SiP) and copper wire bonding.[6][7]
Fan-out wafer-level packaging (FO-WLP), a process that enables ultra-thin, high-density packages, has been around for several years, and the fan-out technology is becoming an industry trend due to increasing market demand for smaller and thinner mobile products. According to the research firm Yole Développement, the fan-out packaging market is predicted to reach $2.4 billion by 2020, increasing from $174 million in 2014.[8]
Wafer-level chip-scale packaging (WL-CSP) is the technology that enables the smallest available packages in the market, meeting the increasing demand for smaller and faster portable consumer devices. This ultra-thin package type has integrated into mobile devices such as smartphones.[8] In October 2001, ASE began volume production of wafer-level chip-scale packages.[9]
References
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- ↑ CNN Money. "Advanced Semiconductor Engineering Inc." May 12, 2016.
- ↑ Lua error in package.lua at line 80: module 'strict' not found.
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- ↑ Yahoo! Finance. “Advanced Semiconductor Engineering Inc. (ASX).” Retrieved April 1, 2016.
- ↑ Ed Sperling, Semiconductor Engineering. "Foundries Versus OSATs." Jul 24, 2014. Retrieved May 19, 2016.
- ↑ 6.0 6.1 Yahoo! Finance. "ASE." Retrieved May 19, 2016.
- ↑ IDC. "What’s Next for Semiconductor Packaging?." Retrieved May 19, 2016.
- ↑ 8.0 8.1 Mark LaPedus, Semiconductor Engineering. "Fan-Out Packaging Gains Steam." Nov 23, 2015. Retrieved May 31, 2016.
- ↑ EDN. "ASE Ramps Wafer Level CSP Production." Oct 12, 2001. Retrieved May 31, 2016.
